Laser Drilling: Blind and Through-Going Drilling?

High speeds and high flexibility are the significant advantages of laser technology when it comes to blind and holes drilling. As with cutting, micro-drilling has two separate laser processes: fusion drilling with pulsed lasers and external gas support, and melt ejection caused by vaporization, such as with q-switched solid-state lasers. Choosing the laser beam’s proper wavelength and power density, for nearly all solid materials such as metals, semiconductors, plastics, ceramics, diamonds can be laser-drilled.

Various Techniques for Laser Drilling

For selective roughening of surfaces for gluing and coating processes, pulse drilling of blind holes at a depth of some microns is used. Single-pulse methods may be used for through holes in small workpiece thicknesses. For thicker materials, percussion drilling is the first option and can be accomplished by applying several laser pulses with the appropriate depth. A combined drilling-cutting method or the multi-pass method is used for trepanning drilling for large diameters. Laser drilling of silicon wafers with Laserod creates virtually no micro cracks or edge melting that could weaken the cell during further processing. Contacted solar cells on the rear side expand the solar-active surface and thereby cell output. Current through-plating technologies include the trepanning of some hundreds of holes with a diameter of up to 500 μm (MWT technology) or percussion drilling of many thousands of 65 μm (EWT technology) holes on each cell. The EWT technology can achieve throughput levels of 4,000 holes/sec during this time-critical processing stage, and the MWT system can achieve up to 100 holes/sec.

Laserod Technologies, the best laser cutting services in California, also specializes in drilling holes small to large by the laser drilling methods of percussion and trepanning.

Our Capabilities and Guidelines for Hole Drilling:

• Accurate, repeatable small holes
 • Any material except glass
 • To 1 mm max depth (.040″)
 • The thinner the material, the better the results and the faster
 • Two methods of drilling: trepanning and percussion
 • The aspect ratio of depth to diameter is about 10:1. Please note this applies to percussion holes ONLY.
Max Hole or Via Depth: 3mm
 • Max Material Thickness: 3mm
 • Min Thickness: none
 • Max Diameter of Trepanned Hole or Via: 12″ (300mm)
 • Range of Percussion Hole Diameters: 10-125 microns depending on the thickness
 • Min Diameter of Percussion Hole or Via: 10 microns
 • RE: “taper”: ask us. (We can control taper.) Taper for a 50um percussion hole in 300um thick silicon would be 50um entrance diameter with 40um exit as a typical example.

For all kinds, project queries contact one of our experts at 310-328-5869