Here's a Quick Way to Solve Blind and Through-Going Drilling With Laser Drilling


                            Laserod

Fast speeds and high versatility are the main benefits of laser processing when it comes to blinds and drilling holes. As with slicing, laser-drilling has two different laser processes: fusion with pulsed lasers drilling and external fuel support, and melt ejection induced by vaporization, just as with q-switched solid-state lasers.

Selecting the perfect wavelength and power intensity of the laser beam for nearly all solid materials such as metals, semiconductors, plastics, ceramics, and diamonds can be laser-drilled. Pulse drilling of blind holes at a depth of some microns is used for selective roughening of surfaces for gluing and coating processes. Single-pulse methods may be used for through holes in small workpiece thicknesses. 

For thicker materials, percussion drilling is the first option and can be accomplished by applying several laser pulses with the appropriate depth. A combined drilling-cutting method or the multi-pass the method is used for trepanning drilling for large diameters. Laser drilling of silicon wafers with Laserod create virtually no micro cracks or edge melting that could weaken the cell during further processing. 

Contacted solar cells on the rear side expand the solar-active surface and thereby cell output. Current through-plating technologies include the trepanning of some hundreds of holes with a diameter of up to 500 μm (MWT technology) or percussion drilling of many thousands of 65 μm (EWT technology) holes in each cell. EWT technology can achieve throughput levels of 4,000 holes/sec during this time-critical processing stage, and the MWT system can achieve up to 100 holes/sec. 

Precision is a passion for Laserod Technologies when it associates with laser micromachining. Be it Femtosecond or Picosecondlaser micromachining. We are committed to producing outstanding micro-machining services to diverse sectors, such as microelectronics, touchscreen producers, aerospace, solar cells, medical, transducer sensors, and many more.

Our domains of expertise include drilling small holes, cutting and precise drilling materials, silicone wafer-coring or resizing, trimming circuits, ceramic, substrate-cutting, and viewing circuits. Call Laserod at 1-310-340-1343 / 1-888-991-9916 for projects and queries.

Comments

Post a Comment

Popular posts from this blog

Choosing The Right Laser Micromachining Service Provider

Image
  In today's challenging industrial settings, the service provider you choose should have adequate testing and measurement equipment to perform satisfactory laser micromachining. This is due to the fact that accuracy is critical for this type of project, and without the appropriate equipment, accuracy cannot be achieved. Not to mention the importance of getting a highly skilled team of experts to carry out the work. There are several machines and operating systems that are essential to conducting proper laser micro-drilling & micromachining services. The automated optical inspection system is one of the most important of this equipment. Ideally, the agency you go for should have at least two of these systems. On the other hand, this should be complemented by at least twice the number of standard optical operating systems. Another device that is essential to conduct laser micromachining is a barcode and ID Matrix code reader. To make the job easier, this code reader should hav...
Read more

What Are The Advantages Of Picosecond Laser Micromachining?

Image
Picosecond lasers are best suited to machine materials that suffer from negative thermal effects during nanosecond laser machining with much higher performance. Nowadays, when it comes to material machining, the term "ultrafast lasers" is used more and more. It is used to distinguish picosecond and femtosecond lasers for applications. In picosecond lasers, the laser pulse length is shorter than the time required for absorbed laser energy to propagate to the substrate and is usually between 5 and 10 picoseconds (ps). Picosecond laser micromachining is becoming increasingly popular due to the outstanding superficial finish. This is accomplished due to lower heating and reduced debris-related effect. Not to mention the enhanced coupling due to the nonlinear intensity-dependent absorption and the obvious ease with which the machining effect can be achieved. The picosecond laser micromachining will produce a minimal size. This delivers features slightly smaller than one micro...
Read more