Here’s What Matters in Laser Micromachining of Silicon

                         

Laser cutting, and also laser fine trimming, is applied to specific types of materials where complicated contours require reliable, fast, and force-free processing. Lasers generate narrow kerfs and make high-precision cuts in this process. This approach reveals no distortion, and in many situations, post-processing is not required as the part is subject to just a limited amount of heat input and can often be cut free of dross.

Nearly all kinds of metals can be cut by laser. The most common applications are silicon, mild steel, stainless steel, and aluminum. Other parts cut by laser are made of wood, plastics, glass, and ceramics. Laser cutting is already cost-effective for small-batch production compared with alternative techniques such as die-cutting. Localized input of laser energy providing small focal diameters, small kerf widths, high feed rate, and minimal heat input is the significant advantage of laser cutting.

Laser Applications on Silicon

Various types of metals, and a wide range of other items, including semiconductors, plastics, organic materials, ceramics, paper, graphite, diamonds, and composite materials, can be cut with the laser. Including very high precision and low heat input, mono and poly-crystalline silicon wafers can be cut at high speeds using the same ablation process as for edge isolation and drilling. Laserod specializes in laser machining of silicon (Si). We offer precision laser cutting, scribing, coring (resizing), flat or notch cutting, micro-drilling holes, singulation, and dicing of silicon and MEMS devices. Typically applications of laser machining silicon include the manufacture of MEMS devices, sensors, detectors, and solar cells.

Precision is a passion for Laserod Technologies when it relates to laser micromachining. Be it femtosecond micromachining or picosecond micromachining. We are dedicated to delivering outstanding micro-machining services to numerous sectors, such as touchscreen producers, aerospace, solar cells, microelectronics, medical, transducer sensors, and others. Our areas of expertise include cutting and precise drilling materials, drilling small holes, silicone wafer-coring / resizing, trimming circuits, ceramic, substrate-cutting, and viewing circuits. Dial Laserod at 1–310–340–1343 / 1–888–991–9916 for more information.